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datasheet product structure : silicon monolithic integrated c ircuit this product has no designed protection against rad ioactive rays . 1/18 tsz02201-0q3q0jz00270-1- 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 tsz22111 14 001 www.rohm.com simple design with built-in self-controlled cell ba lance features circuit cell balance lsi of 4 to 6 series power storage element cells for automotive bd14000efv-c general description bd14000efv is a lsi ic designed as a self-controlled cell balancer. it has a built-in shunt-type power s torage element balancer function that can respond to 4 to 6 cells. all the functions necessary in a cell balanc er are built-in making power storage element cell balancin g possible only in this lsi. this chip can be used for electric double layer capacitors (edlc) with cell detection voltage range of 2.4v to 3.1v and power storage capacitors which is important for cell balancers with similar electrica l characteristics it has a built-in multiple over-voltage detection f unction and can also detect abnormal mode such as any characteristic deterioration in cells. also, application-dependent operation can be set sin ce enable control is possible. features aec-q100 qualified (note1) all edlc cell balancer functions are integrated on a single chip self- controlled edlc balance function adopts shunt resistance method for simple balancing 4 to 6 cell series connection ready multiple chip series connection is possible built-in over-voltage detection flag output detection voltage can be set (note1 : grade2) applications renewable energy power storage for automotive, production machinery, building machinery, etc. ups and other devices that stabilizes power supplies key specifications input voltage range 8.0v to 24.0v cell voltage detection range 2.4v to 3.1v cell voltage detection accuracy 1 (max. at 25c) shunt switch on resistance 1 ? (typ.) operating temp. range -40c to +105c package w (typ) x d (typ) x h (max) htssop-b30 10.00mm x 7.60mm x 1.00mm htssop-b30 typical application circuit figure 1 typical application circuit downloaded from: http:///
d a t a sh e e t 2/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c pin configuration _ _ _ tt _ t t t t figure 2 pin configuration pin description pin no. symbol function pin no. symbol function 1 c6 positive (+) connection terminal pin of cell 6 16 c1 positive (+) connection terminal pin of cell 1 2 d6 shunt switch connection terminal pin for cell 6. 17 d1 shunt switch connection terminal pin for cell 1 3 s6 shunt switch connection terminal pin for cell 6. 18 s1 shunt switch connection terminal pin for cell 1 4 c5 positive (+) connection terminal pin of cell 5 19 vss analog ground (connect to (-) side of bottom cell) 5 d5 shunt switch connection terminal pin for cell 5. 20 vset2 detection voltage setting input pin 2 6 s5 shunt switch connection terminal pin for cell 5. 21 vset1 detection voltage setting input pin 1 7 c4 positive (+) connection terminal pin of cell 4. 22 vset0 detection voltage setting input pin 0 8 d4 shunt switch connection terminal pin for cell 4. 23 ovlosel over-voltage detection setting input pin 9 s4 shunt switch connection terminal pin for cell 4. 24 test0 test terminal pin (connect to vss) 10 c3 positive (+) connection terminal pin of cell 3. 25 enin enable signal input pin 11 d3 shunt switch connection terminal pin for cell 3. 26 vo_ok self-check ok signal output pin 12 s3 shunt switch connection terminal pin for cell 3. 27 vo_ovlo2 overvoltage flag output pin 2 13 c2 positive (+) connection terminal pin of cell 2 28 vo_ovlo1 overvoltage flag output pin 1 14 d2 shunt switch connection terminal pin for cell 2. 29 vreg regulator circuit output pin (output capacitor : 1.0 f) 15 s2 shunt switch connection terminal pin for cell 2. 30 vcc regulator circuit power input pin the back pad is used for enhancing the radiation of heat. this pad is needed to connect vss. test0 : this pin is used for rohm internal test. thi s pin is needed to connect vss for normal operation. downloaded from: http:///
d a t a sh e e t 3/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c block diagram t , , t _ _ t t tt t t t t t t _ figure 3 block diagram downloaded from: http:///
d a t a sh e e t 4/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c description of blocks control block 1. cell voltage detection block setting the detection voltage is possible with cell balance voltage detection and two types of ovlo avai lable for each cell. additionally, protection detection error can be cont rolled by setting delays for each voltage detection . 2. detect control block on/off control is possible by setting the enin pin. additionally, cell detection voltages can be set via vset0, 1, 2 and ovlosel pins. reg block this is used as a power block for the chips intern al blocks. this block can also be used as i/f power source of control input/output. shunt sw shunt switch is used for the cell balancing function. swdet swdet detects if the drain pins (d1~d6) are normally changed to l when cell balance voltage is detected as a self-check function flag output 2 types of ovlo are output from vo_ovlo1, 2. self-chec k function is output from vo_ok. absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage vcc,vcn(n=6) to vss v1-1 -0.3 to 28 v supply voltage vcn to vcn-1(n=2~6) vc1 to vss vdn to vsn (n=1~6) v2-1 -0.3 to 7 v supply voltage vreg,enin,vo_ovlo1,vo_ovlo2, vo_ok,ovlosel,vset0,vset1, vset2,test0 to vss v2-2 -0.3 to 7 v power dissipation pd 1.55 *1 w operating temperature range topr -40 to +105 c storage temperature range tstg -55 to 150 c * 1 this value is for rohm standard board (1 layer 70x 70x1.6mm) mounting. for temperatures above 25c, us e a 12.4mw/c derating factor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a shor t circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection mea sures, such as adding a fuse, in cases where the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= -40c to +105c) parameter symbol rating unit vcc voltage vcc 8.0 to 24 v downloaded from: http:///
d a t a sh e e t 5/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c electrical characteristics (unless otherwise specified vcc=15v ta=25c) parameter symbol min typ max unit conditions circuit current vcc circuit current when on ivcc 40 80 a enin=h during cell balance start voltage non-detection vcc circuit current when standby on 25 50 a enin=l cn(n=1~6) pin circuit current when on ivcc 20 40 a enin=h,vcn-vcn-1=2.5v during cell balance start voltage non-detection cn(n=5,6) pin circuit current when standby icn off56 - 1 8 a enin=l, vcn-vcn-1=2.5v cn(n=1~4) pin circuit current when standby off - 0 5 a enin=h,vcn-vcn-1=2.5v cell voltage detection cell balance start detection voltage range vcb 2.4 3.1 v set by vset0 2 pin cell balance start detection accuracy1 vcb err1 1 % cell balance start detection accuracy2 vcb err2 2 % ta=-40 105c over- voltage detection 1 detection voltage1 vovlo 1-1 vcb +0.15 v set by vset0 2 pin and ovlosel=l over- voltage detection 1 detection voltage2 vovlo 1-2 vcb +0.25 v set by vset0 2 pin and ovlosel=h over- voltage detection 1 detection accuracy vovlo1 err 2 % ta=-40 105c over- voltage detection 2 detection voltage1 vovlo2 -1 vcb +0.3 v set by vset0 2 pin and ovlosel=l over- voltage detection 2 detection voltage2 vovlo2 -2 vcb +0.5 v set by vset0 2 pin and ovlosel=h over- voltage detection 2 detection accuracy vovlo2 err 2 % ta=-40 105c built-in oscillator frequency fosc 20 40 80 khz vreg output voltage vreg 3.6 4.3 5.0 v io=10ma downloaded from: http:///
d a t a sh e e t 6/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c electrical characteristics (unless otherwise specified vcc=15v ta=25c) parameter symbol min typ max unit conditions shunt sw switch on resistance in between dn-sn (n=1~6) ronsw 1.0 2.0 ? vcn-vcn-1=2.5v leak current during switch off in between dn-sn (n=1~6) ileaio w 2 a vdn-vsn-1=3.5v digital input/ output terminal output l level voltage (vo_ovlo1.2,vo_ok) vol ovlo 0.2 0.5 v iin=5ma leak current when off (vo_ovlo1.2,vo_ok) ilfak ovlo 2 a vin=3.5v input h level voltage (enin) vihen 1.8 vreg +0.2 v input l level voltage (enin) vilen -0.3 0.4 v input current when h level input. (enin) iihen 3.5 7.0 a vin=3.5v input h level voltage (vset0 2,ovlosel) vih set vreg x0.8 vreg +0.2 v input l level voltage (vset0 2,ovlosel) vil set -0.3 vreg x0.2 v input current when h level input (vset0 2,ovlosel) iih set 2 a vin=3.5v output current when l level input (vset0 2,ovlosel) iil set 2 a vin=0.0v downloaded from: http:///
d a t a sh e e t 7/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c typical performance curves figure 4. detection voltage for cell balance vs. te mp. (detection voltage setting= 3.10v) figure 5. detection voltage for ovlo1 vs. temp. (detection voltage=3.35v setting) figure 6. ovlo2 detection voltage vs. temp. (detection voltage=3.60v setting) figure 7. vreg vs io (vcc=15v) downloaded from: http:///
d a t a sh e e t 8/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c function description and items that need attention 1. setting the operation mode from the enable term inal it is possible to control the cell balancer functio n on/off setting of the ic via the operation mode s etting pin (enin) the settings for each input terminal is shown on the following table input balancer setting remarks enin on/off 0 off standby 1 on operating when standby, only the internal power supply (vreg) i s operational. when operating, the other blocks are also operation al. 2. detection voltage setting by using the detection voltage setting termina l pins (vset0,1 and 2), setting the cell balance start detection voltage (vcb) and over-voltage detection voltage 1,2 (vovlo1,2) is possible. output for each input terminal is sho wn on the following table: input output vset2 vset1 vset0 vcb[v] vovlo1[v] vovlo2[v] 0 0 0 2.4 vcb + 0.15 (*1) or vcb + 0.25 (*2) vcb + 0.3 (*1) or vcb + 0.5 (*2) 0 0 1 2.5 0 1 0 2.6 0 1 1 2.7 1 0 0 2.8 1 0 1 2.9 1 1 0 3.0 1 1 1 3.1 (*1) ovlosel=l condition (*2) ovlosel=h condition 3. over-voltage flag output the over- voltage detection output terminals (vo_ovlo1, 2) are the or output signals of the chips built-in over- voltage detection 1 and 2 output signals. the flag output logic is shown on the following tab les: built-in over- voltage detection (ovlo1) output (vo_ovlo1) non-detection hi-z detection l built-in over- voltage detection (ovlo2) output (vo_ovlo2) non-detection hi-z detection l downloaded from: http:///
d a t a sh e e t 9/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c 4. self-check function this chip has a built-in self-check function to confirm if its cell balance function is working properly. when cell balance detection voltage is exceeded, th e shunt sw turns on to make cell balance self-check function possible. the self-check ok detection output terminal (vo_ok) be comes the and output of the output signals of the se lf-check function of each of this lsis cells. this function is available for 4-, 5- or 6-cell applications. the plug detection logic is shown on the following table: built-in self-check detection output vo_ok non-detection hi-z detection (ok) l to cope with 4-cell and 5-cell application, the det ection pin gives an output as a dummy when not yet used in the detect block for 5, 6 cells. because of that, the ce ll check pin gives output detect ok (l) in case th e cell 5 or cell 6 is either shorted or damaged. during that time, cell m odule voltage becomes unbalanced and abnormal detec tion is possible by monitoring the overvoltage pin detect (l) when the cell module becomes fully charged. 5. detection time setting for cell balance voltage detection (vcb) and over-vol tage detection 1, 2 (vovlo1, 2), the detection time d elays can be set for transitions from non-detection to detect ion and detection to non-detection. during non-detection, if detection signal matches t he 4x td at td=25msec (typ) intervals, the detectio n flag will output. also, during detection, if the non-detection signal matches the 4x td at td=25msec (typ) intervals, the non-detection flag will output. through this, detection time delay can be s et from 75msec (3x td) to 100msec (4x td) (typ) as detection time delay. figure 8. detection time setting 6. vreg terminal application vreg output voltage is used as i/f power supply and c ontrol power supply for the chips internal blocks. it is assumed that up to 10ma maximum is applied as external load, and since it is a basic simple powe r supply, it can only apply power to i/f. please use only after a thorough inspection of electrical characteristics and confirm that no problem will arise from use. it is recommended to use a ceramic capacitor with a capacitance equal or greater than 1uf between vreg t o vss. please select a capacitor with good dc bias characte ristics and with a high capacitance value. 7. detecting operation when cell voltage is up internal detector output of this chip varies with r espect to the rise time of the cell voltage. please use only after a thorough inspection of electrical characteristics a nd confirm that no problem will arise from use. 8. cn(n=1-6) terminal application when detect voltage may be influenced by noise from board or module, please use ceramic capacitors bet ween cn (n=1-6) to vss for stable detection only after a th orough inspection of electrical characteristics and confirm that no problem will arise from use. downloaded from: http:///
d a t a sh e e t 10/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c application example when using the power storage element with 4 cells a nd 5 cells, please connect all the unused terminals to the cn terminal where n is the number of actual cells in series. th is chip can respond to 4 to 6 cells, but cannot res pond to 3 cells or fewer than 3 cells. sample pin connections for 6 cells sample pin connections for 5 cells sample pin connections for 4 cells (short the unused termin al to c5 terminal) (short the unused terminals to c4 terminal) figure 9. application circuit downloaded from: http:///
d a t a sh e e t 11/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c when using the power storage element for connection of over 8 cells, series connection of this chip is possible. enable control (enin pin control) and flag output (vo_ovlo1, vo_ovlo2, vo_ok pin output) are also available in the s eries connection by using the following application circu it. figure 10. application circuit for bd14000efv-c serie s connection downloaded from: http:///
d a t a sh e e t 12/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c power dissipation the maximum allowable junction temperature tj of bd1 4000efv-c is 150c. therefore, it is necessary to de sign the system requirements and the board layout so tha t the junction temperature does not exceed 150 c in the operating temperature range. [] t t [] ? ? t = = = = figure 11. power dissipation [maximum value of shunt current for cell balance] temperature increase, t up [c], of this chip can be estimated by total power consumption p all [w] and thermal resistance ja [c /w]: t up = p all x ja almost all of the power of this chip is consumed by shunt switches: t up = n x r on x i shunt 2 x ja (r on [ ? ] = shunt switch on resistance, i shunt [a] = shunt current, n[pcs] = the number of cells) so, the operating condition is described as follows: t j C t a_max > t up (t a_max [c] = maximum operating temperature) it is possible to decide shunt current value by u sing this expression. (example) t j =150c, t a_max =105c, ja =80.6c /w (rohm standard board, 1 layer board), r on_max =2.0 ? , n=6pcs by using the above expressions, 150 C 105 > 6 x 2 x i shunt 2 x 80.6 ? i shunt < 0.215a downloaded from: http:///
d a t a sh e e t 13/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c i/o equivalent circuits pin no. pin name i/o equivalent circuit 1 18 a: cn b: dn c: sn (n=1 6) 29 vreg 25 24 enin test0 22 21 20 23 vset0 vset1 vset2 ovlosel 28 27 26 vo_ovlo1 vo_ovlo2 vo_ok figure 12. i/o equivalent circuit downloaded from: http:///
d a t a sh e e t 14/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedanc e supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient co ndition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that th e ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. in cas e of exceeding this absolute maximum rating, increa se the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the interna l powering sequence and delays, especially if the i c has more than one power supply. therefore, give spe cial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing o f connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacito rs completely after each process or step. the ics power supply should always be turned off completely before conne cting or removing it from the test setup during the inspection process. to prevent damage from static discharge, g round the ic during assembly and use similar precau tions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct w hen mounting the ic on the pcb. incorrect mounting ma y result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in between pi ns during assembly to name a few. downloaded from: http:///
d a t a sh e e t 15/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high im pedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless othe rwise specified, unused input pins should be connec ted to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p subs trate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of the p layers with the n layers of other eleme nts, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the p-n junction ope rates as a parasitic diode. when gnd > pin b, the p-n junction operates as a para sitic transistor. parasitic diodes inevitably occur in the structure o f the ic. the operation of parasitic diodes can res ult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 13. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. over current protection circuit (ocp) this ic incorporates an integrated over current pro tection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damag e due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by contin uous operation or transitioning of the protection c ircuit. downloaded from: http:///
d a t a sh e e t 16/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c ordering information b d 1 4 0 0 0 e f v - c e 2 part number package efv: htssop-b30 product rank c: for automotive packaging and forming specification e2: embossed tape and reel(2000pcs) b d 1 4 0 0 0 e f v - c h 2 part number package efv: htssop-b30 product rank c: for automotive packaging and forming specification h2: embossed tape and reel(250pcs) marking diagrams htssop-b30 (top view) bd14000efv part number marking lot number 1pin mark downloaded from: http:///
d a t a sh e e t 17/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c physical dimension, tape and reel information package name htssop-b30 downloaded from: http:///
d a t a sh e e t 18/18 tsz02201 - 0q3q0 j z00270 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22.jun.2015 rev.002 www.rohm.com tsz22111 15 001 bd14000efv-c revision history date revision changes 9.jul.2014 001 new release 22,jun,2015 002 added aec-q100 operating temperature grade added ordering information for h2 type added tape and reel information for h2 type downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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